Development Specification - Barix Ip Audio Module

Introduction

About the Barix IP Audio Module

The Barix IP Audio Module allows manufacturers of traditional audio devices to add network
capabilities to their products.


Features:

High quality, multi standard audio encoding and decoding in formats:

• G.711 (μLaw / aLaw 8 and 24 kHz sampling rate)
• 16bit PCM uncompressed (8 and 24 kHz)
• MP3 Layer 1 (32, 44.1 and 48 kHz)
• MP3 Layer 2 (16, 22.05 and 24 kHz)

Bidirectional audio transport over IP:

• Push to talk (PTT)
• software controlled
• audio level controlled
• full duplex for G.711
• Dual 100Mbit Ethernet ports (1 with PHY), suitable for bridging / daisy chaining
• Microphone input (coil, powered or passive capacitive)
• Standard stereo Line In and 3Vpp audio signal outputs
• 1 S/P DIF Input and 1 S/P DIF Output
• 2 TTL level UARTs, 1 USB1.1 interface, 1 CAN Bus interface
• Small form factor (53mm x 39mm x 6mm)
• Low Power consumption (1.6W max.)
• Runs off a single +5Volt DC power source
• Integrated CPU / MAC / IO controller @ 12 to 125 MHz with on-chip 256 KB zero
  wait state static RAM
• 2 KB EEprom for configuration store
• 1 MB Flash memory for application and web server content
• Embedded and robust operating system with fully routable IP stack
• IP standard based protocols (TCP/IP, UDP, HTTP, ICMP, SNMP)
• Supports BootP, DHCP and Auto IP
• Integrated web server for configuration, control, update and streaming functions
• Fully documented Application Programming Interface (API)
• Highly customizable User Interface (HTML) with development kit
• Special software features in OEM versions on request

Application Fields

The Barix IP Audio Module is suitable in the following application fields:

• Interfacing of digital or analog audio signals to TCP/IP, web, Intranet and
  Internet
• Intercom systems
• Paging systems
• Broadcast equipment
• Audio monitoring
• Audio distribution
• Updatable, standalone player
• Alarm systems
• Audio recording (Live audio transmission)
  Depending on the host’s capabilities UDP, TCP, or HTTP (web based) communication methods can be used.
  

In addition, the Barix IP Audio Module contains a web server which allows a customized user
interface without any special software other than a browser on the host.



Hardware


Mechanical Drawing

The Barix IP Audio Module can be plugged onto the target connector or motherboard using three,
high density, 0.8mm spacing, SMT connectors.

For mechanical fixation, the board provides two 2.7mm mounting holes for 2.5mm screws.
The total size is 53.0mm +/-0.2 by 39.0mm +/-0.2.

Maximum component height is 6mm. Using standard distance bolts a total height of 8mm can be
achieved when mounted on a carrier board.

Block Diagram

Network Interfaces

1 x PHY (TP or FO), 1 x MII
The Barix IP Audio Module is equipped with one on-chip physical layer (PHY) Ethernet interface
(10/100MBit, full / half duplex, auto negotiation) which supports either a twisted pair port or a fiber
optic link. A second Ethernet port can be used by adding a standard PHY chip to the OEM carrier
board connected to the MII interface of the Barix IP Audio Module.


Serial Interfaces

2 x UART (TTL level, TX, RX, RTS, CTS), 1 x CAN-Bus, 1 x USB 1.1
Two separate serial ports can be used to build serial standard interfaces like RS-232 or RS-485 by
attaching external driver chips. Special serial framing (9bit protocols, bi-phase encoding etc) or
speeds (up to 1MBit) can be implemented for OEM versions.
One CAN-Bus and one USB 1.1 standard interface are provided on connector J1 and can be
supported in OEM versions.


Digital Audio

1 x S/P DIF In, 1 x S/P DIF Out, 1 x I2S
Three digital audio interfaces are provided on the Barix IP Audio Module. The S/P DIF input allows
connecting of a coaxial or optical receiver circuit, the S/P DIF output can be used to connect to
coaxial or optical driver the I2S interface can be used to connect to I2S capable devices.

Analog Audio

1 x Stereo Input (L&R), 1 x Stereo Output (L&R), 1 x Microphone Input (Bias powered),
Three analog audio interfaces are provided on the Barix IP Audio Module. The stereo input allows
the connection of analog audio sources, the stereo output can be used to connect to analog
amplifiers and the microphone input (with Bias output to power integrated preamp) allows the use
of a wide selection of microphones (dynamic, capacitive, FET amplified).

Peripheral I/O

13 x PIO
Thirteen 3.3VDC digital I/Os are available on the Barix IP Audio Module and can be used by OEM
software as either input or output. The inputs tolerate 5VDC Logic Level and outputs supply
3.3VDC. One I/O pin can be used as a hardware timer input instead and two other I/O pins can
serve as a I2C interface.

Power supply

4 x VIN, 4 x SGND
Eight connector pins are provided to power the Barix IP Audio Module from a single +5 Volt DC
power source. The maximum power consumption is 1.6 Watt.


Layout guidelines

General rules

• A low ESR Capacitor of 10uF to 47uF in parallel to a low loss ceramic 100nF capacitor is
  recommended as power supply bypass close to the Barix Audio Module's power supply pins.
• All available ground pins of the Barix Audio Module should be attached to their respective
  ground domain.
• Avoid any connection of ground domains on the Carrier PCB as the ground interconnection is
  made on the Barix Audio Module already.
• Avoid signal trace routing crossing domain borders.
• Restricted Area A must not contain any high current switching circuitry nor any components
  creating magnetic flux.
• Flood unused PCB areas with copper and connect those planes to it's respective ground.
  

Carrier PCB view

Technical data

• CPU's, speed, memory
  Lantronix DSTni-EX,12-125MHz clock software selectable, 256KB SRAM
• Audio processor
  Micronas MAS3587F MPEG-1/2 Layer-3 Encoder/Decoder or MAS3509F Decoder
• Non-volatile storage
  1MB Flash ROM (approximately 700KB available for user data)
  2KB EEprom for configuration
• Serial Interfaces
  2 x UART (TTL level, TX, RX, RTS, CTS), 1 x CAN-Bus, 1 x USB 1.1
• Network Interfaces
  1 x 10/100 Base (integrated PHY for twisted pair or fiber optic link)
  1x 10/100 Base MII port (needs PHY chip on OEM carrier board to connect to RJ45 socket)
• Peripheral I/O
  13 x inputs/outputs (inputs 5VDC tolerant, outputs 3.3VDC)
  (1 x I/O selectable as hardware timer input / 2 x I/O selectable as I2C interface instead)
• Input Power Range
  5VDC nominal (min. 4VDC / max. 5.5VDC)
• Power Consumption
  max. 1.6 Watt
• Dimensions
  53.0mm +/-0.2 by 39.0mm +/-0.2.
  2 mounting holes for 2.5mm screws (drill size 2.7mm).
  Maximum component height 6mm. (total 8mm when mounted on carrier board)
• Weight
  approx. 80g
• Environmental
  conditions
  32 ~ 131° F / 0 ~ 55° C,
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Connectors

Connector placement

For connector placement please refer to the mechanical drawing in chapter Hardware.

Connector Pin out J1
No; Name T; Description; N; Name T; Description
1; TX+ O; PHY level positive Transmit; 2; DGND P; Digital Ground
3; TXCT R; Trans. Transformer center Tap; 4; LED.3 O; see DSTni EX
5; TX- O; PHY level negative Transmit; 6; LED.2 O; see DSTni EX
7; DGND P; Digital Ground; 8; DGND P; Digital Ground
9; RX+ I; PHY level positive Receive; 10; DGND P; Digital Ground
11; RXCT R; Rec. Transformer center Tap; 12; LED.1 O; see DSTni EX
13; RX- I; PHY level negative Receive; 14; LED.0 O; see DSTni EX
15; DGND P; Digital Ground; 16; DGND P; Digital Ground
17; RXD0 I; 2nd MAC receive data 0 (LSB) ; 18; RXCRS I; 2nd MAC receive carrier sense
19; RXD1 I; 2nd MAC receive data 1; 20; RXCOL I; 2nd MAC receive collision
21; RXD2 I; 2nd MAC receive data 2; 22; RXCLK I; 2nd MAC receive clock
23; RXD3 I; 2nd MAC receive data 3 (MSB) ; 24; RXERR I; 2nd MAC receive error
25; FOUT+ O; Fiberoptic Interface TX positive; 26; FOUT- O; Fiberoptic Interface TX negative
27; FIN+ I; Fiberoptic Interface RX positive; 28; FIN- I; Fiberoptic Interface RX negative
29; DGND P; Digital Ground; 30; DGND P; Digital Ground
31; CANTX O; CAN-Bus Interface Transmit; 32; FSD I; Fiberoptic Interface input detect
33; CANRX I; CAN-Bus Interface Receive; 34; RESV R; Fiberoptic current resistor
35; DGND P; Digital Ground; 36; VREF R; Fiberoptic Interface Voltage ref.
37; DGND P; Digital Ground; 38; DGND P; Digital Ground
39; USB+ U; USB 1.1 Host Interface positive; 40; USB- U; USB 1.1 Host Interface negative

In the column Name T the T stands for Type:
O=Output, I=Input, P=Power, U=USB bus, R=Special function
N. Name T Description N. Name T Description

Connector Pin out J2
N; Name T; Description; N; Name T; Description
1; PIO20 C; DSTni EX PIO #20; 2; CTS.0 I; UART 0 flow control input
3; PIO8 C; DSTni EX PIO #8; 4; RTS.0 O; UART 0 flow control output
5; PIO22 C; DSTni EX PIO #22; 6;RXD.0 I; UART 0 receive data
7; PIO23 C; DSTni EX PIO #23; 8;TXD.0 O; UART 0 transmit data
9; DGND P; Digital Ground; 10; DGND P; Digital Ground
11; PIO16 C; DSTni EX PIO #16; 12; CTS.1 I; UART 1 flow control input
13; PIO17 C; DSTni EX PIO #17; 14; RTS.1 O; UART 1 flow control output
15; PIO24 C; DSTni EX PIO #24; 16; TXD.1 O; UART 1 transmit data
17; PIO25 C; DSTni EX PIO #25; 18; RXD.1 I; UART 0 receive data
19; DVCC P; LED return (DVCC) ; 20; DGND P; Digital Ground
21; PIO29 C; DSTni EX PIO #29; 22; I²CCLK C; I²C Clock / PIO #31
23; PIO30 C; DSTni EX PIO #30; 24; I²CDAT C; I²C Data / PIO #26
25; TMR.0 C; Timer 0 ext. input / PIO #11; 26; -RST D; Low active Reset I/O
27; MDC O; MII Management IF Clock; 28; MDIO B; MII Management IF Data
29; DGND P; Digital Ground; 30; DGND P; Digital Ground
31; TXD0 O; 2nd MAC transmit data 0 (LSB) ; 32 TXCLK I; 2nd MAC transmit clock
33; TXD1 O; 2nd MAC transmit data 1; 34; TXERR O; 2nd MAC transmit error
35; TXD2 O; 2nd MAC transmit data 2 36; TXEN O; F 2nd MAC transmit enable
37; TXD3 O; 2nd MAC transmit data 3 (MSB) 38; RXDV I; 2nd MAC receive data valid
39; DGND P; Digital Ground 40; DGND P; Digital Ground

In the column Name T the T stands for Type:
O=Output, I=Input, B=Bidirectional, P=Power, C=configurable as input or output,
D=Open Drain (pull-up resistor on module)

Connector Pin out J3
N; Name T; Description; N; Name T; Description
1; AGND P; Audio Ground; 2; OUTL A; Left channel audio output
3; - - reserved; 4; AGND P; Audio Ground
5; AGND P; Audio Ground; 6; OUTR A; Right channel audio output
7; - -; reserved; 8; AGND P; Audio Ground
9; AGND P; Audio Ground; 10; INL a; Left channel audio input
11; - -; reserved; 12; AGND P; Audio Ground
13; - -; reserved; 14; INR a; Right channel audio input
15; AGND P; Audio Ground; 16; AGND P; Audio Ground
17; AGND P; Audio Ground; 18; MICBI A; Microphone Bias output
19; AGND P; Audio Ground; 20; MICIN a; Microphone input
21; AGND P; Audio Ground; 22; AGND P; Audio Ground
23; DGND P; Digital Ground; 24; DGND P; Digital Ground
25; SPDO O; S/P DIF output; 26; SOC B; I²S serial clock in/output
27; SPDIR R; S/P DIF reference; 28; SOD O; I²S serial data output
29; SPDI2 I; S/P DIF input 2; 30; SOI O; I²S frame indication
31; SPDI1 I; S/P DIF input 1; 32; DGND P; Digital Ground
33; SGND P; Supply input Ground; 34; SGND P; Supply input Ground
35; SGND P; Supply input Ground; 36; SGND P Supply input Ground
37; VIN P; Audio module input Voltage; 38; VIN P; Audio module input Voltage
39; VIN P; Audio module input Voltage; 40; VIN P; Audio module input Voltage

In the column Name T the T stands for Type:
O=Output, I=Input, B=Bidirectional, P=Power, A=Audio Output, a=Audio Input